Circuit Board Process Chart
THERMAL TRANSFER PRINTABLE PRODUCTS CIRCUIT BOARD PROCESS CHART |
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Through Hole Technology |
Surface Mount Technnology (SMT) |
After |
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Top |
Bottom |
Top or Bottom |
Process |
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B-426, B-436, B-457, B-477, B-478, B-479, B-487, B-497 |
Yes |
Yes |
Yes |
Yes |
| B-495 |
Yes |
No |
Yes |
Yes |
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B-422, B-423, B-428, B-433, B-435, B-438, B-459, B-473, B-488, B-498 |
Yes* |
No |
No |
Yes |
* In extreme high temperatures, testing of these materials is recommended.
LASER PRINTABLE PRODUCTS CIRCUIT BOARD PROCESS CHART |
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Through Hole Technology |
Surface Mount Technnology (SMT) |
After |
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Top |
Bottom |
Top or Bottom |
Process |
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| B-652 |
Yes |
Yes |
Yes |
Yes |
| B-409, B-709, B-747, B-773, B-799 |
Yes* |
No |
No |
Yes |
* In extreme high temperatures, testing of these materials is recommended.
DOT MATRIX CIRCUIT BOARD PROCESS CHART |
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Through Hole Technology |
Surface Mount Technnology (SMT) |
After |
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Top |
Bottom |
Top or Bottom |
Process |
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| B-652, B-658 |
Yes |
Yes |
Yes |
Yes |
| B-164 |
Yes |
No |
Yes |
Yes |
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B-110, B-499, B-502, B-607, B-619, B-637, |
Yes* |
No |
No |
Yes |
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